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Publication numberUSD554593 S1
Publication typeGrant
Application numberUS 29/269,183
Publication dateNov 6, 2007
Filing dateNov 22, 2006
Priority dateNov 22, 2006
Publication number269183, 29269183, US D554593 S1, US D554593S1, US-S1-D554593, USD554593 S1, USD554593S1
InventorsSharon Greenberg, Trung Nguyen
Original AssigneeIntest Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Signal module
US D554593 S1
Abstract  available in
Images(5)
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Claims(1)
  1. The ornamental design for a signal module, as shown and described.
Description

FIG. 1 is a perspective view of a signal module.

FIG. 2 is a front view of the signal module illustrated in FIG. 1; the rear being a mirror image thereof.

FIG. 3 is a side view of the signal module shown in FIG. 1; the other side being a mirror image thereof; and,

FIG. 4 is a top view of the signal module illustrated in FIG. 1; the bottom being a mirror image thereof.

The signal module is shown broken away in FIGS. 1, 2 and 3 of the drawings to indicate indeterminate length, it being understood that it has a uniform shape and appearance throughout its length.

The features indicated in the figures in broken lines form no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8201328 *Dec 4, 2008Jun 19, 2012Tyco Electronics CorporationCoaxial cable to printed circuit board interface module
US20090258538 *Dec 4, 2008Oct 15, 2009Roya YaghmaiCoaxial cable to printed circuit board interface module
Classifications
U.S. ClassificationD13/162