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Publication numberUSD555150 S1
Publication typeGrant
Application numberUS 29/253,784
Publication dateNov 13, 2007
Filing dateFeb 13, 2006
Priority dateFeb 13, 2006
Publication number253784, 29253784, US D555150 S1, US D555150S1, US-S1-D555150, USD555150 S1, USD555150S1
InventorsStephen M. Christopher, Jeong J. Ma
Original AssigneeMotorola Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Housing for a headset
US D555150 S1
Abstract  available in
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  1. The ornamental housing for a headset, as shown and described.

FIG. 1 is a perspective view of a housing for a headset showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a side view thereof;

FIG. 5 is an opposite side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line portions of the drawings form no part of the claimed design or a specified embodiment thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20110085685 *Oct 8, 2009Apr 14, 2011Victor Kingsun WaiSound Amp Ear Device with Ear Phone Jack
U.S. ClassificationD14/223