|Publication number||USD555150 S1|
|Application number||US 29/253,784|
|Publication date||Nov 13, 2007|
|Filing date||Feb 13, 2006|
|Priority date||Feb 13, 2006|
|Publication number||253784, 29253784, US D555150 S1, US D555150S1, US-S1-D555150, USD555150 S1, USD555150S1|
|Inventors||Stephen M. Christopher, Jeong J. Ma|
|Original Assignee||Motorola Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (1), Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Housing for a headset
US D555150 S1
The ornamental housing for a headset, as shown and described.
FIG. 1 is a perspective view of a housing for a headset showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a side view thereof;
FIG. 5 is an opposite side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The broken line portions of the drawings form no part of the claimed design or a specified embodiment thereof.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US20110085685 *||Oct 8, 2009||Apr 14, 2011||Victor Kingsun Wai||Sound Amp Ear Device with Ear Phone Jack|