|Publication number||USD556157 S1|
|Application number||US 29/217,730|
|Publication date||Nov 27, 2007|
|Filing date||Nov 22, 2004|
|Priority date||May 28, 2004|
|Publication number||217730, 29217730, US D556157 S1, US D556157S1, US-S1-D556157, USD556157 S1, USD556157S1|
|Inventors||Keisuke Kondoh, Hiroki Oka, Makoto Tashiro|
|Original Assignee||Tokyo Electron Limited|
|Export Citation||BiBTeX, EndNote, RefMan|
|External Links: USPTO, USPTO Assignment, Espacenet|
The present article relates to a load-lock chamber for a multi-chamber type semiconductor substrate processing apparatus for a film forming process and other processes for semiconductor substrates, and others to be processed. The load-lock chamber is, as shown in a reference drawing illustrating a state of usage of the load-lock chamber, connected to a transfer-chamber wherein load-in and load-out of substrates to be processed are carried out without exposing the transfer-chamber to air.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.