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Publication numberUSD556157 S1
Publication typeGrant
Application numberUS 29/217,730
Publication dateNov 27, 2007
Filing dateNov 22, 2004
Priority dateMay 28, 2004
Publication number217730, 29217730, US D556157 S1, US D556157S1, US-S1-D556157, USD556157 S1, USD556157S1
InventorsKeisuke Kondoh, Hiroki Oka, Makoto Tashiro
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Load-lock chamber
US D556157 S1
Abstract  available in
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  1. The ornamental design for a load-lock chamber, as shown and described.

The present article relates to a load-lock chamber for a multi-chamber type semiconductor substrate processing apparatus for a film forming process and other processes for semiconductor substrates, and others to be processed. The load-lock chamber is, as shown in a reference drawing illustrating a state of usage of the load-lock chamber, connected to a transfer-chamber wherein load-in and load-out of substrates to be processed are carried out without exposing the transfer-chamber to air.

FIG. 1 is a top view of the load-lock chamber,

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a sectional view taken along line 7-7 in FIG. 1;

FIG. 8 is a perspective view thereof; and,

FIG. 9 is a reference figure showing a bottom perspective view thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

U.S. ClassificationD13/182