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Publication numberUSD556158 S1
Publication typeGrant
Application numberUS 29/255,524
Publication dateNov 27, 2007
Filing dateMar 8, 2006
Priority dateNov 18, 2005
Publication number255524, 29255524, US D556158 S1, US D556158S1, US-S1-D556158, USD556158 S1, USD556158S1
InventorsXiang-Jian Kong
Original AssigneeHon Hai Precision Industry Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Printed circuit board
US D556158 S1
Abstract  available in
Images(6)
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Claims(1)
  1. The ornamental design for a printed circuit board, as shown and described.
Description

FIG. 1 is a top, front and right side perspective view of a printed circuit board showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Classifications
U.S. ClassificationD13/182