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Publication numberUSD556692 S1
Publication typeGrant
Application numberUS 29/270,693
Publication dateDec 4, 2007
Filing dateJan 3, 2007
Priority dateJan 3, 2007
Publication number270693, 29270693, US D556692 S1, US D556692S1, US-S1-D556692, USD556692 S1, USD556692S1
InventorsMitsutoshi Yahagi, Kenichi Abe, Yuji Araki
Original AssigneeEbara Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Electrical contact for use in a plating apparatus
US D556692 S1
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.
Description

FIG. 1 is a perspective view of an electrical contact for use in a plating apparatus in accordance with the present design;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD669439Oct 23, 2012Ebara CorporationElectrical contact
USD742329Jan 27, 2015Nov 3, 2015Ebara CorporationElectrical contact for use in a plating apparatus
Classifications
U.S. ClassificationD13/148