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Publication numberUSD556704 S1
Publication typeGrant
Application numberUS 29/236,982
Publication dateDec 4, 2007
Filing dateAug 25, 2005
Priority dateAug 25, 2005
Publication number236982, 29236982, US D556704 S1, US D556704S1, US-S1-D556704, USD556704 S1, USD556704S1
InventorsTsutomu Nakamura, Susumu Tauchi, Akitaka Makino
Original AssigneeHitachi High-Technologies Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grounded electrode for a plasma processing apparatus
US D556704 S1
Images(5)
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Claims(1)
  1. The ornamental design for grounded electrode for a plasma processing apparatus, as shown.
Description

FIG. 1 is a front, top and right side perspective view of grounded electrode for a plasma processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan elevational view thereof.

Classifications
U.S. ClassificationD13/182
Legal Events
DateCodeEventDescription
Sep 28, 2005ASAssignment
Owner name: ENPLAS CORPORATION, JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MIYOSHI, KOZO;REEL/FRAME:017054/0851
Effective date: 20050905