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Publication numberUSD559064 S1
Publication typeGrant
Application numberUS 29/213,407
Publication dateJan 8, 2008
Filing dateSep 17, 2004
Priority dateMar 17, 2004
Also published asUSD576855
Publication number213407, 29213407, US D559064 S1, US D559064S1, US-S1-D559064, USD559064 S1, USD559064S1
InventorsTakahiro Okamoto, Hiroshi Shiho
Original AssigneeJsr Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad
US D559064 S1
Abstract  available in
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  1. The ornamental design for a polishing pad, as shown and described.

FIG. 1 is a top plan view of the polishing pad;

FIG. 2 is a front elevational view thereof, the left side elevational view, right side elevational view, and rear elevational view each being a mirror image of the front view shown;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is an enlarged, partial view thereof taken at coordinates 44 in FIG. 1;

FIG. 5 is a cross-sectional view thereof taken along line 55 in FIG. 4;

FIG. 6 is a further enlargement of the cross-sectional view of part 6 of FIG. 5; and,

FIG. 7 is a further enlargement of the cross-sectional view of part 7 of FIG. 6.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9180570Mar 16, 2009Nov 10, 2015Nexplanar CorporationGrooved CMP pad
USD767840Nov 13, 2014Sep 27, 2016Maruishi Sanyo Co., LtdPolishing pad
U.S. ClassificationD08/70