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Publication numberUSD559065 S1
Publication typeGrant
Application numberUS 29/225,834
Publication dateJan 8, 2008
Filing dateMar 22, 2005
Priority dateOct 5, 2004
Publication number225834, 29225834, US D559065 S1, US D559065S1, US-S1-D559065, USD559065 S1, USD559065S1
InventorsHiroyuki Miyauchi, Hiroshi Shiho
Original AssigneeJsr Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad
US D559065 S1
Abstract  available in
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  1. The ornamental design for a polishing pad, as shown and described.

FIG. 1 is a top plan view of a polishing pad, showing our new design;

FIG. 2 is a front elevational view thereof, the rear, left, and right side elevational views being mirror images of the view shown;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is an enlarged, partial top plan view thereof taken along the intersection of lines 44 in FIG. 1;

FIG. 5 is an enlarged, partial sectional view thereof taken along line 55 in FIG. 4;

FIG. 6 is a greatly enlarged, partial cross-sectional view thereof taken along line 6 in FIG. 5; and,

FIG. 7 is an enlarged, partial bottom plan view taken along the intersection of lines 77 in FIG. 3.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9017140Jan 13, 2010Apr 28, 2015Nexplanar CorporationCMP pad with local area transparency
US9156124Jul 8, 2010Oct 13, 2015Nexplanar CorporationSoft polishing pad for polishing a semiconductor substrate
US9180570Mar 16, 2009Nov 10, 2015Nexplanar CorporationGrooved CMP pad
U.S. ClassificationD08/70