USD559065S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD559065S1
USD559065S1 US29/225,834 US22583405F USD559065S US D559065 S1 USD559065 S1 US D559065S1 US 22583405 F US22583405 F US 22583405F US D559065 S USD559065 S US D559065S
Authority
US
United States
Prior art keywords
polishing pad
view
taken along
enlarged
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/225,834
Inventor
Hiroyuki Miyauchi
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Assigned to JSR CORPORATION reassignment JSR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIYAUCHI, HIROYUKI, SHIHO, HIROSHI
Application granted granted Critical
Publication of USD559065S1 publication Critical patent/USD559065S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a polishing pad, showing our new design;
FIG. 2 is a front elevational view thereof, the rear, left, and right side elevational views being mirror images of the view shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is an enlarged, partial top plan view thereof taken along the intersection of lines 44 in FIG. 1;
FIG. 5 is an enlarged, partial sectional view thereof taken along line 55 in FIG. 4;
FIG. 6 is a greatly enlarged, partial cross-sectional view thereof taken along line 6 in FIG. 5; and,
FIG. 7 is an enlarged, partial bottom plan view taken along the intersection of lines 77 in FIG. 3.

Claims (1)

  1. The ornamental design for a polishing pad, as shown and described.
US29/225,834 2004-10-05 2005-03-22 Polishing pad Expired - Lifetime USD559065S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004030299 2004-10-05

Publications (1)

Publication Number Publication Date
USD559065S1 true USD559065S1 (en) 2008-01-08

Family

ID=38893602

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/225,834 Expired - Lifetime USD559065S1 (en) 2004-10-05 2005-03-22 Polishing pad

Country Status (1)

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US (1) USD559065S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate

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