USD559065S1 - Polishing pad - Google Patents
Polishing pad Download PDFInfo
- Publication number
- USD559065S1 USD559065S1 US29/225,834 US22583405F USD559065S US D559065 S1 USD559065 S1 US D559065S1 US 22583405 F US22583405 F US 22583405F US D559065 S USD559065 S US D559065S
- Authority
- US
- United States
- Prior art keywords
- polishing pad
- view
- taken along
- enlarged
- partial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
Claims (1)
- The ornamental design for a polishing pad, as shown and described.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004030299 | 2004-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD559065S1 true USD559065S1 (en) | 2008-01-08 |
Family
ID=38893602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/225,834 Expired - Lifetime USD559065S1 (en) | 2004-10-05 | 2005-03-22 | Polishing pad |
Country Status (1)
Country | Link |
---|---|
US (1) | USD559065S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
-
2005
- 2005-03-22 US US29/225,834 patent/USD559065S1/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
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