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Publication numberUSD559186 S1
Publication typeGrant
Application numberUS 29/213,525
Publication dateJan 8, 2008
Filing dateSep 20, 2004
Priority dateSep 20, 2004
Publication number213525, 29213525, US D559186 S1, US D559186S1, US-S1-D559186, USD559186 S1, USD559186S1
InventorsIlan Kelmer
Original AssigneeRit Technologies Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
High-density patch panel
US D559186 S1
Abstract  available in
Images(11)
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Claims(1)
  1. The ornamental design for a high-density patch panel, as shown and described.
Description

FIG. 1 is a top, front and left side perspective view of a high-density patch panel, showing my new design;

FIG. 2 is an enlarged portion of the top, front and left side perspective view thereof;

FIG. 3 is a top, rear and right side perspective view thereof;

FIG. 4 is an enlarged portion of the top, rear and right side perspective view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a rear elevation view thereof;

FIG. 7 is an enlarged portion of the rear elevation view thereof;

FIG. 8 is an enlarged side elevation view thereof;

FIG. 9 is a top plan view thereof; and,

FIG. 10 is a bottom plan view thereof.

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US9285552Jan 31, 2014Mar 15, 2016Commscope Technologies LlcOptical assemblies with managed connectivity
US9341802Sep 16, 2015May 17, 2016Commscope Technologies LlcTelecommunications assembly
US20090225667 *Mar 5, 2009Sep 10, 2009Adc Telecommunications, Inc.System and method for electronically identifying connections of a cross-connect system
US20110185012 *Jan 27, 2010Jul 28, 2011Colley Matthew DSystem and method for generating a notification mailing list
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US20150147914 *Nov 24, 2014May 28, 2015Foxconn Interconnect Technology LimitedElectrical connector having an improved structure for assembling a contact module to an insulative housing
Classifications
U.S. ClassificationD13/147