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Publication numberUSD560457 S1
Publication typeGrant
Application numberUS 29/225,832
Publication dateJan 29, 2008
Filing dateMar 22, 2005
Priority dateOct 5, 2004
Publication number225832, 29225832, US D560457 S1, US D560457S1, US-S1-D560457, USD560457 S1, USD560457S1
InventorsHiroyuki Miyauchi, Hiroshi Shiho
Original AssigneeJsr Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad
US D560457 S1
Abstract  available in
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  1. The ornamental design for a polishing pad, as shown and described.

FIG. 1 is a top plan view of a polishing pad, showing our new design;

FIG. 2 is a front elevational view thereof, the rear, left, and right side elevational views being mirror images of the view shown;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is an enlarged, partial top plan view thereof taken along the intersection of lines 44 in FIG. 1;

FIG. 5 is an enlarged, partial cross-sectional view thereof taken along line 55 in FIG. 4;

FIG. 6 is a greatly enlarged, partial cross-sectional view thereof taken along line 6 in FIG. 5; and,

FIG. 7 is an enlarged, partial bottom plan view of taken along the intersection of lines 77 in FIG. 3.

The broken line showing of portions of the polishing pad is for illustrative purposes only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9017140Jan 13, 2010Apr 28, 2015Nexplanar CorporationCMP pad with local area transparency
U.S. ClassificationD08/70