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Publication numberUSD560623 S1
Publication typeGrant
Application numberUS 29/240,402
Publication dateJan 29, 2008
Filing dateOct 11, 2005
Priority dateOct 11, 2005
Publication number240402, 29240402, US D560623 S1, US D560623S1, US-S1-D560623, USD560623 S1, USD560623S1
InventorsJames Harnden, Anthony Chia, Liming Wong, Hongbo Yang
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Quad-24JW surface mount package
US D560623 S1
Abstract  available in
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  1. The ornamental design for quad-24JW surface mount package, as shown and described.

FIG. 1 is a perspective view of a quad-24JW surface mount package showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a right side elevational view thereof.

U.S. ClassificationD13/182