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Publication numberUSD561120 S1
Publication typeGrant
Application numberUS 29/266,730
Publication dateFeb 5, 2008
Filing dateSep 28, 2006
Priority dateSep 28, 2006
Publication number266730, 29266730, US D561120 S1, US D561120S1, US-S1-D561120, USD561120 S1, USD561120S1
InventorsChin-Ming Chen, Yuhsien Lin, Tsung-Lin Chen, Alex Hsia
Original AssigneeDelta Electronics, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipating module
US D561120 S1
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  1. The ornamental design for a heat dissipating module, as shown and described herein.

FIG. 1 is a perspective view of a heat dissipating module;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7480144 *Nov 3, 2006Jan 20, 2009Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
US7495921 *Apr 2, 2007Feb 24, 2009Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Fan bracket and heat dissipation apparatus incorporating the same
US7532472 *Nov 28, 2006May 12, 2009Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device
U.S. ClassificationD13/179