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Publication numberUSD561123 S1
Publication typeGrant
Application numberUS 29/271,910
Publication dateFeb 5, 2008
Filing dateJan 30, 2007
Priority dateJan 30, 2007
Publication number271910, 29271910, US D561123 S1, US D561123S1, US-S1-D561123, USD561123 S1, USD561123S1
InventorsMasataka Mochizuki, Yuji Saito
Original AssigneeFujikura Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink
US D561123 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a heat sink, as shown and described.
Description

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right elevational view thereof;

FIG. 4 is a left elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view similar to FIG. 1 showing the fan removed form the extrusion.

A rear elevational view is the same as the right elevational view.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7495921 *Apr 2, 2007Feb 24, 2009Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Fan bracket and heat dissipation apparatus incorporating the same
US7532472 *Nov 28, 2006May 12, 2009Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device
US7583503 *Mar 10, 2008Sep 1, 2009Asia Vital Components Co., Ltd.Thermal module allowing adjustment in the height of heat sink relative to fixing rack
Classifications
U.S. ClassificationD13/179