|Publication number||USD561743 S1|
|Application number||US 29/254,879|
|Publication date||Feb 12, 2008|
|Filing date||Mar 1, 2006|
|Priority date||Mar 1, 2006|
|Publication number||254879, 29254879, US D561743 S1, US D561743S1, US-S1-D561743, USD561743 S1, USD561743S1|
|Inventors||Chao Huang, Jeong J. Ma|
|Original Assignee||Motorola, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (1), Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Housing for a headset
US D561743 S1
The ornamental housing for a headset, as shown.
FIG. 1 is a perspective view of a housing for a headset.
FIG. 2 is a front view thereof.
FIG. 3 is a rear view thereof.
FIG. 4 is a first side view thereof.
FIG. 5 is a second side view thereof.
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a top view thereof.
The broken line portions of the drawings form no part of the claimed design or a specified embodiment thereof.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US20110085685 *||Oct 8, 2009||Apr 14, 2011||Victor Kingsun Wai||Sound Amp Ear Device with Ear Phone Jack|