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Publication numberUSD564455 S1
Publication typeGrant
Application numberUS 29/200,741
Publication dateMar 18, 2008
Filing dateMar 3, 2004
Priority dateMar 3, 2004
Publication number200741, 29200741, US D564455 S1, US D564455S1, US-S1-D564455, USD564455 S1, USD564455S1
InventorsYim Kwong Ng, Edward Chen, Michael Campbell
Original AssigneeNortel Networks Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Circuit pack
US D564455 S1
Abstract  available in
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  1. The ornamental design for a circuit pack, as shown and described.

FIG. 1 is an isometric view of a circuit pack with the door closed showing our design.

FIG. 2 is a front view of the circuit pack with the door closed.

FIG. 3 is an isometric view of the circuit pack with the door open; and,

FIG. 4 is a front view of the circuit pack with the door open.

The top, bottom, and sides of the circuit pack are unornamented.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

U.S. ClassificationD13/158