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Publication numberUSD564460 S1
Publication typeGrant
Application numberUS 29/276,415
Publication dateMar 18, 2008
Filing dateJan 25, 2007
Priority dateJan 25, 2007
Publication number276415, 29276415, US D564460 S1, US D564460S1, US-S1-D564460, USD564460 S1, USD564460S1
InventorsTakaya Otsuki, Takamasa Yamashita, Kazuhiro Inouchi
Original AssigneeNidec Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink fan
US D564460 S1
Abstract  available in
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  1. The ornamental design for a heat sink fan, as shown and described.

FIG. 1 is a front elevation view of a heat sink fan showing our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7495921 *Apr 2, 2007Feb 24, 2009Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Fan bracket and heat dissipation apparatus incorporating the same
US7532472 *Nov 28, 2006May 12, 2009Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device
US7583503 *Mar 10, 2008Sep 1, 2009Asia Vital Components Co., Ltd.Thermal module allowing adjustment in the height of heat sink relative to fixing rack
U.S. ClassificationD13/179