|Publication number||USD566060 S1|
|Application number||US 29/240,188|
|Publication date||Apr 8, 2008|
|Filing date||Oct 11, 2005|
|Priority date||Apr 13, 2005|
|Also published as||USD577691, USD577692|
|Publication number||240188, 29240188, US D566060 S1, US D566060S1, US-S1-D566060, USD566060 S1, USD566060S1|
|Inventors||Tetsuya Ohsawa, Emiko TANI|
|Original Assignee||Nitto Denko Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (1), Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Grooves formed around a semiconductor device on a circuit board
US D566060 S1
The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.
FIG. 2 shows an enlarged view of the claimed portion identified by the dot-dash line in FIG. 1; and,
FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.
The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show environmental detail for illustrative purposes only and form no part of the claimed design.
|Citing Patent||Filing date||Publication date||Applicant||Title|
|USD731990 *||Oct 17, 2012||Jun 16, 2015||Nok Corporation||Integrated circuit tag|