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Publication numberUSD566060 S1
Publication typeGrant
Application numberUS 29/240,188
Publication dateApr 8, 2008
Filing dateOct 11, 2005
Priority dateApr 13, 2005
Also published asUSD577691, USD577692
Publication number240188, 29240188, US D566060 S1, US D566060S1, US-S1-D566060, USD566060 S1, USD566060S1
InventorsTetsuya Ohsawa, Emiko TANI
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grooves formed around a semiconductor device on a circuit board
US D566060 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
Description

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of the claimed portion identified by the dot-dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 33 in FIG. 2.

The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show environmental detail for illustrative purposes only and form no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD731990 *Oct 17, 2012Jun 16, 2015Nok CorporationIntegrated circuit tag
Classifications
U.S. ClassificationD13/182