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Publication numberUSD567772 S1
Publication typeGrant
Application numberUS 29/279,172
Publication dateApr 29, 2008
Filing dateApr 23, 2007
Priority dateDec 29, 2006
Publication number279172, 29279172, US D567772 S1, US D567772S1, US-S1-D567772, USD567772 S1, USD567772S1
InventorsYu-Chen Lin, Hong-Bo Xu
Original AssigneeHon Hai Precision Industry Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink
US D567772 S1
Images(8)
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Claims(1)
  1. The ornamental design for a heat sink, as shown.
Description

FIG. 1 is a perspective view of a heat sink of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7639497 *Dec 10, 2007Dec 29, 2009Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device having a fan mounted thereon
Classifications
U.S. ClassificationD13/179
Legal Events
DateCodeEventDescription
Aug 21, 2008ASAssignment
Owner name: NANO ORTHOPEDICS, LLC, FLORIDA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KIM, BYUNG-SOO;REEL/FRAME:021425/0017
Effective date: 20080818
Aug 13, 2008ASAssignment
Owner name: NANO ORTHOPEDICS, LLC, FLORIDA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KIM, BYUNG-SOO;REEL/FRAME:021377/0869
Effective date: 20070302