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Publication numberUSD567774 S1
Publication typeGrant
Application numberUS 29/268,261
Publication dateApr 29, 2008
Filing dateNov 1, 2006
Priority dateMay 1, 2006
Also published asUSD584249, USD584250
Publication number268261, 29268261, US D567774 S1, US D567774S1, US-S1-D567774, USD567774 S1, USD567774S1
InventorsEmiko TANI, Tetsuya Ohsawa
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Groove formed around a semiconductor device on a circuit board
US D567774 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.
Description

FIG. 1 shows a plan view of the groove formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 3 shows an enlarged sectional view along the line 33 in FIG. 2.

FIG. 4 shows an enlarged sectional view along the line 44 in FIG. 2.

FIG. 5 shows a perspective view of the design in FIG. 1; and,

FIG. 6 shows an enlarged sectional view along the line 44 in FIG. 2, on which an environment semiconductor device is disposed.

The broken lines represent unclaimed subject matter.

Classifications
U.S. ClassificationD13/182