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Publication numberUSD568836 S1
Publication typeGrant
Application numberUS 29/240,252
Publication dateMay 13, 2008
Filing dateOct 11, 2005
Priority dateApr 13, 2005
Also published asUSD585394
Publication number240252, 29240252, US D568836 S1, US D568836S1, US-S1-D568836, USD568836 S1, USD568836S1
InventorsTetsuya Ohsawa, Emiko TANI
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Groove formed around a semiconductor device on a circuit board
US D568836 S1
Images(4)
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Claims(1)
  1. The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.
Description

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1; and,

FIG. 3 is a sectional view taken along line 33 in FIG. 2.

The broken lines represent unclaimed subject matter.

Classifications
U.S. ClassificationD13/182
Legal Events
DateCodeEventDescription
Dec 20, 2005ASAssignment
Owner name: INTERDIGITAL TECHNOLOGY CORPORATION, DELAWARE
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHAN, TIEJUN;REEL/FRAME:016923/0660
Effective date: 20051207