|Publication number||USD568836 S1|
|Application number||US 29/240,252|
|Publication date||May 13, 2008|
|Filing date||Oct 11, 2005|
|Priority date||Apr 13, 2005|
|Also published as||USD585394|
|Publication number||240252, 29240252, US D568836 S1, US D568836S1, US-S1-D568836, USD568836 S1, USD568836S1|
|Inventors||Tetsuya Ohsawa, Emiko TANI|
|Original Assignee||Nitto Denko Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1), Legal Events (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Groove formed around a semiconductor device on a circuit board
US D568836 S1
The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.
FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;
FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1; and,
FIG. 3 is a sectional view taken along line 3—3 in FIG. 2.
The broken lines represent unclaimed subject matter.
|Dec 20, 2005||AS||Assignment|
Owner name: INTERDIGITAL TECHNOLOGY CORPORATION, DELAWARE
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHAN, TIEJUN;REEL/FRAME:016923/0660
Effective date: 20051207