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Publication numberUSD568838 S1
Publication typeGrant
Application numberUS 29/268,260
Publication dateMay 13, 2008
Filing dateNov 1, 2006
Priority dateMay 1, 2006
Also published asUSD580895
Publication number268260, 29268260, US D568838 S1, US D568838S1, US-S1-D568838, USD568838 S1, USD568838S1
InventorsNaohiro Terada, Kouji Kataoka, Tetsuya Ohsawa, Toshiki Naito
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grooves formed around a semiconductor device on a circuit board
US D568838 S1
Images(7)
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Claims(1)
  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
Description

FIG. 1 is a plan view of a first embodiment of the grooves formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1;

FIG. 3 is a sectional view taken along line 33 in FIG. 2;

FIG. 4 is a sectional view taken along line 44 in FIG. 2;

FIG. 5 is a plan view of a second embodiment;

FIG. 6 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 5;

FIG. 7 is a sectional view taken along line 77 in FIG. 6;

FIG. 8 is a sectional view taken along line 88 in FIG. 6;

FIG. 9 is a plan view of a third embodiment;

FIG. 10 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 9;

FIG. 11 is a sectional view taken along line 1111 in FIG. 10; and,

FIG. 12 is a sectional view taken along line 1212 in FIG. 10.

The broken lines represent unclaimed subject matter.

Classifications
U.S. ClassificationD13/182