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Publication numberUSD568841 S1
Publication typeGrant
Application numberUS 29/275,334
Publication dateMay 13, 2008
Filing dateDec 21, 2006
Priority dateDec 21, 2006
Publication number275334, 29275334, US D568841 S1, US D568841S1, US-S1-D568841, USD568841 S1, USD568841S1
InventorsLarry G. Fischer, Michael J. Hermel, Eric s. Moreau, Gregory Martell
Original AssigneeAdc Telecommunications, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Enclosure for electronic components
US D568841 S1
Abstract  available in
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  1. The ornamental design for an enclosure for electronic components, as shown and described.

FIG. 1 is an elevated perspective view of an enclosure for electronic components incorporating a design according to the invention.

FIG. 2 is a left side view of the enclosure of FIG. 1.

FIG. 3 is a right side view of the enclosure of FIG. 1.

FIG. 4 is an end view of the enclosure of FIG. 1; and,

FIG. 5 is a bottom view of the enclosure of FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20130223012 *Feb 23, 2013Aug 29, 2013Futurewei Technologies, Inc.Apparatus and Method for an Active Antenna Heat Sink
U.S. ClassificationD13/184