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Publication numberUSD571739 S1
Publication typeGrant
Application numberUS 29/242,544
Publication dateJun 24, 2008
Filing dateNov 14, 2005
Priority dateAug 12, 2005
Publication number242544, 29242544, US D571739 S1, US D571739S1, US-S1-D571739, USD571739 S1, USD571739S1
InventorsHiroki Hosaka
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor wafer delivery apparatus
US D571739 S1
Abstract  available in
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  1. The ornamental design for a semiconductor wafer delivery apparatus, as shown and described.

FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 77 in FIG. 1;

FIG. 8 is a top, front and right perspective view thereof; and,

FIG. 9 is a top and left rear perspective view thereof.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

U.S. ClassificationD13/182