FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a cross-sectional view taken along line 7—7 in FIG. 1;
FIG. 8 is a top, front and right perspective view thereof; and,
FIG. 9 is a top and left rear perspective view thereof.
The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.