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Publication numberUSD571740 S1
Publication typeGrant
Application numberUS 29/242,546
Publication dateJun 24, 2008
Filing dateNov 14, 2005
Priority dateAug 12, 2005
Publication number242546, 29242546, US D571740 S1, US D571740S1, US-S1-D571740, USD571740 S1, USD571740S1
InventorsHiroki Hosaka
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor wafer delivery apparatus
US D571740 S1
Images(10)
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Claims(1)
  1. The ornamental design for a semiconductor wafer delivery apparatus, as shown and described.
Description

FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 77 in FIG. 1;

FIG. 8 is a top and right front perspective view thereof; and,

FIG. 9 is a top and right rear perspective view thereof.

The broken line showing and the indicia shown in the Figures are shown for illustrative purposes only and form no part of the claimed design.

Classifications
U.S. ClassificationD13/182