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Publication numberUSD572669 S1
Publication typeGrant
Application numberUS 29/284,191
Publication dateJul 8, 2008
Filing dateSep 1, 2007
Priority dateSep 1, 2007
Publication number284191, 29284191, US D572669 S1, US D572669S1, US-S1-D572669, USD572669 S1, USD572669S1
InventorsShih-Jie Jiang
Original AssigneeAsia Vital Components Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation assembly
US D572669 S1
Images(7)
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Claims(1)
  1. The ornamental design for a heat dissipation assembly, as shown.
Description

FIG. 1 is a perspective view of a heat dissipation assembly showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20110036545 *Aug 12, 2009Feb 17, 2011Tsung-Hsien HuangHigh-performance heat sink
Classifications
U.S. ClassificationD13/179