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Publication numberUSD572670 S1
Publication typeGrant
Application numberUS 29/266,467
Publication dateJul 8, 2008
Filing dateSep 22, 2006
Priority dateMar 30, 2006
Also published asUSD592159, USD615933
Publication number266467, 29266467, US D572670 S1, US D572670S1, US-S1-D572670, USD572670 S1, USD572670S1
InventorsMasato Ono, Hiroshi Miyairi, Masaru Kato, Kazunori Watanabe
Original AssigneeNichia Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Light emitting diode
US D572670 S1
Abstract  available in
Images(21)
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Claims(1)
  1. The ornamental design for a light emitting diode, as shown and described.
Description

FIG. 1 is a front top side perspective view of a light emitting diode in accordance with a first embodiment of my new design;

FIG. 2 is a top plan view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 3 is a bottom plan view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 4 is a front elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 5 is a rear elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 6 is a left side end elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 7 is a right side end elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 8 is a front top side perspective view of a light emitting diode in accordance with a second embodiment of my new design;

FIG. 9 is a top plan view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 10 is a bottom plan view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 11 is a front elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 12 is a rear elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 13 is a left side end elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 14 is a right side end elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 15 is a front top side perspective view of a light emitting diode in accordance with a third embodiment of my new design;

FIG. 16 is a top plan view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 17 is a bottom plan view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 18 is a front elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 19 is a rear elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 20 is a left side end elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 21 is a right side end elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 22 is a front top side perspective view of a light emitting diode in accordance with a fourth embodiment of my new design;

FIG. 23 is a top plan view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 24 is a bottom plan view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 25 is a front elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 26 is a rear elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 27 is a left side end elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 28 is a right side end elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 29 is a front top side perspective view of a light emitting diode in accordance with a fifth embodiment of my new design;

FIG. 30 is a top plan view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 31 is a bottom plan view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 32 is a front elevational view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 33 is a rear elevational view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 34 is a left side end elevational view of the light emitting diode in accordance with the fifth embodiment of my new design; and,

FIG. 35 is a right side end elevational view of the light emitting diode in accordance with the fifth embodiment of my new design.

The broken line showing of environment (the remaining structure of the light emitting diode) in the Figures is for illustrative purposes only and forms no part of the claimed design.

The opaque line shading illustrates a translucent portion of the light emitting diode.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7635915Apr 26, 2006Dec 22, 2009Cree Hong Kong LimitedApparatus and method for use in mounting electronic elements
US7675145Mar 28, 2006Mar 9, 2010Cree Hong Kong LimitedApparatus, system and method for use in mounting electronic elements
US7821023May 23, 2008Oct 26, 2010Cree, Inc.Solid state lighting component
US8049230 *Nov 1, 2011Cree Huizhou Opto LimitedApparatus and system for miniature surface mount devices
US8217412Jul 10, 2012Cree, Inc.Solid state lighting component
US8350370Jan 8, 2013Cree Huizhou Opto LimitedWide angle oval light emitting diode package
US8362605Jan 29, 2013Cree Huizhou Opto LimitedApparatus and method for use in mounting electronic elements
US8367945Aug 16, 2006Feb 5, 2013Cree Huizhou Opto LimitedApparatus, system and method for use in mounting electronic elements
US8368112Feb 5, 2013Cree Huizhou Opto LimitedAligned multiple emitter package
US8415692Apr 9, 2013Cree, Inc.LED packages with scattering particle regions
US8455882Jun 4, 2013Cree, Inc.High efficiency LEDs
US8564004Nov 29, 2011Oct 22, 2013Cree, Inc.Complex primary optics with intermediate elements
US8598809Aug 19, 2009Dec 3, 2013Cree, Inc.White light color changing solid state lighting and methods
US8669572Jun 10, 2005Mar 11, 2014Cree, Inc.Power lamp package
US8698171Jun 5, 2012Apr 15, 2014Cree, Inc.Solid state lighting component
US8735920Jul 31, 2006May 27, 2014Cree, Inc.Light emitting diode package with optical element
US8748915Aug 25, 2010Jun 10, 2014Cree Hong Kong LimitedEmitter package with angled or vertical LED
US8791471Nov 7, 2008Jul 29, 2014Cree Hong Kong LimitedMulti-chip light emitting diode modules
US8866169Apr 9, 2010Oct 21, 2014Cree, Inc.LED package with increased feature sizes
US9012938Apr 9, 2010Apr 21, 2015Cree, Inc.High reflective substrate of light emitting devices with improved light output
US9035439Jan 28, 2010May 19, 2015Cree Huizhou Solid State Lighting Company LimitedApparatus, system and method for use in mounting electronic elements
US9070850Oct 31, 2007Jun 30, 2015Cree, Inc.Light emitting diode package and method for fabricating same
US9076940Aug 20, 2013Jul 7, 2015Cree, Inc.Solid state lighting component
US20060278882 *Jun 10, 2005Dec 14, 2006Cree, Inc.Power lamp package
US20070235845 *Mar 28, 2006Oct 11, 2007Cotco Holdings Limited, A Hong Kong CorporationApparatus, system and method for use in mounting electronic elements
US20070252250 *Apr 26, 2006Nov 1, 2007Cotco Holdings Limited, A Hong Kong CorporationApparatus and method for use in mounting electronic elements
US20080041625 *Aug 16, 2006Feb 21, 2008Cotco Holdings Limited, A Hong Kong CorporationApparatus, system and method for use in mounting electronic elements
US20080218973 *Feb 12, 2008Sep 11, 2008Cotco Luminant Device, Ltd.Apparatus, system and method for use in mounting electronic elements
US20090050908 *Jun 5, 2008Feb 26, 2009Cree, Inc.Solid state lighting component
US20090072251 *Dec 14, 2007Mar 19, 2009Cotco Luminant Device LimitedLED surface-mount device and LED display incorporating such device
US20090108281 *Oct 31, 2007Apr 30, 2009Cree, Inc.Light emitting diode package and method for fabricating same
US20090283781 *May 16, 2008Nov 19, 2009Cree Hong Kong LimitedMini V SMD
US20100052126 *Mar 4, 2010Cree Hong Kong LimitedApparatus and method for use in mounting electronic elements
US20100155748 *Jan 14, 2009Jun 24, 2010Cree Hong Kong LimitedAligned multiple emitter package
US20110001151 *Jan 6, 2011Cree, Inc.Led packages with scattering particle regions
US20110012143 *Sep 16, 2010Jan 20, 2011Cree, Inc.Solid state lighting component
US20110043137 *Aug 19, 2009Feb 24, 2011Cree Led Lighting Solutions, Inc.White light color changing solid state lighting and methods
USD615504 *Oct 31, 2007May 11, 2010Cree, Inc.Emitter package
USD633631Mar 1, 2011Cree Hong Kong LimitedLight source of light emitting diode
USD634863Mar 22, 2011Cree Hong Kong LimitedLight source of light emitting diode
USD656906Dec 8, 2010Apr 3, 2012Cree Hong Kong LimitedLED package
USD662902Jul 3, 2012Cree Hong Kong LimitedLED package
USD671661Nov 27, 2012Cree Hong Kong LimitedLED package
USD746240Dec 30, 2013Dec 29, 2015Cree, Inc.LED package
Classifications
U.S. ClassificationD13/180