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Publication numberUSD573110 S1
Publication typeGrant
Application numberUS 29/282,736
Publication dateJul 15, 2008
Filing dateJul 27, 2007
Priority dateJul 27, 2007
Publication number282736, 29282736, US D573110 S1, US D573110S1, US-S1-D573110, USD573110 S1, USD573110S1
InventorsTakaya Otsuki, Takamasa Yamashita, Akira Hirakawa
Original AssigneeNidec Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink
US D573110 S1
Abstract  available in
Images(9)
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Claims(1)
  1. The ornamental design for a heat sink, as shown and described.
Description

FIG. 1 is a front elevation view of a heat sink according to our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is another perspective view thereof.

Classifications
U.S. ClassificationD13/179