Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD574792 S1
Publication typeGrant
Application numberUS 29/272,820
Publication dateAug 12, 2008
Filing dateFeb 20, 2007
Priority dateAug 23, 2006
Publication number272820, 29272820, US D574792 S1, US D574792S1, US-S1-D574792, USD574792 S1, USD574792S1
InventorsIzumi Sato
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Lower heat insulating cylinder for manufacturing semiconductor wafers
US D574792 S1
Abstract  available in
Images(11)
Previous page
Next page
Claims(1)
  1. The ornamental design for a lower heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
Description

FIG. 1 is a perspective view of the design for a lower heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a front view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is another top view thereof which shows sectional line 99;

FIG. 9 is a sectional view thereof along line 99 of FIG. 8; and,

FIG. 10 shows a lower heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention in use wherein the broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Classifications
U.S. ClassificationD13/182