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Publication numberUSD576855 S1
Publication typeGrant
Application numberUS 29/295,220
Publication dateSep 16, 2008
Filing dateSep 24, 2007
Priority dateMar 17, 2004
Also published asUSD559064
Publication number29295220, 295220, US D576855 S1, US D576855S1, US-S1-D576855, USD576855 S1, USD576855S1
InventorsTakahiro Okamoto, Hiroshi Shiho
Original AssigneeJsr Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad
US D576855 S1
Abstract  available in
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  1. The ornamental design for a polishing pad, as shown and described.

FIG. 1 is a top plan view of a polishing pad, showing our new design;

FIG. 2 is a front elevational view thereof, the left side elevational view, right side elevational view, and rear elevational views each being a mirror image of the front view shown;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is an enlarged, partial view thereof taken at coordinates 44 in FIG. 1;

FIG. 5 is a cross-sectional view thereof taken along line 55 in FIG. 4;

FIG. 6 is an enlarged, partial cross-sectional view taken along part 6 of FIG. 5; and,

FIG. 7 is an enlarged, partial cross-sectional view taken along part 7 in FIG. 6.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9017140Jan 13, 2010Apr 28, 2015Nexplanar CorporationCMP pad with local area transparency
US9156124Jul 8, 2010Oct 13, 2015Nexplanar CorporationSoft polishing pad for polishing a semiconductor substrate
US9180570Mar 16, 2009Nov 10, 2015Nexplanar CorporationGrooved CMP pad
USD795666 *Jun 6, 2014Aug 29, 2017Diamond Tool Supply, Inc.Polishing pad
U.S. ClassificationD08/70