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Publication numberUSD577691 S1
Publication typeGrant
Application numberUS 29/303,833
Publication dateSep 30, 2008
Filing dateFeb 19, 2008
Priority dateApr 13, 2005
Also published asUSD566060, USD577692
Publication number29303833, 303833, US D577691 S1, US D577691S1, US-S1-D577691, USD577691 S1, USD577691S1
InventorsTetsuya Ohsawa, Emiko TANI
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grooves formed around a semiconductor device on a circuit board
US D577691 S1
Abstract  available in
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  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of the claimed portion identified by the area boxed by the dot-dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line III—III in FIG. 2.

The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show unclaimed subject matter forming no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD731990 *Oct 17, 2012Jun 16, 2015Nok CorporationIntegrated circuit tag
U.S. ClassificationD13/182