Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD577692 S1
Publication typeGrant
Application numberUS 29/303,837
Publication dateSep 30, 2008
Filing dateFeb 19, 2008
Priority dateApr 13, 2005
Also published asUSD566060, USD577691
Publication number29303837, 303837, US D577692 S1, US D577692S1, US-S1-D577692, USD577692 S1, USD577692S1
InventorsTetsuya Ohsawa, Emiko TANI
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grooves formed around a semiconductor device on a circuit board
US D577692 S1
Abstract  available in
Previous page
Next page
  1. The ornamental design for grooves formed around a semiconductor device on a board, as shown and described.

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of the claimed portion identified by the area boxed by the dot- dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 33 in FIG. 2.

The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show unclaimed subject matter forming no part of the claimed design.

U.S. ClassificationD13/182