|Publication number||USD577692 S1|
|Application number||US 29/303,837|
|Publication date||Sep 30, 2008|
|Filing date||Feb 19, 2008|
|Priority date||Apr 13, 2005|
|Also published as||USD566060, USD577691|
|Publication number||29303837, 303837, US D577692 S1, US D577692S1, US-S1-D577692, USD577692 S1, USD577692S1|
|Inventors||Tetsuya Ohsawa, Emiko TANI|
|Original Assignee||Nitto Denko Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Grooves formed around a semiconductor device on a circuit board
US D577692 S1
The ornamental design for grooves formed around a semiconductor device on a board, as shown and described.
FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.
FIG. 2 shows an enlarged view of the claimed portion identified by the area boxed by the dot- dash line in FIG. 1; and,
FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.
The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show unclaimed subject matter forming no part of the claimed design.