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Publication numberUSD580894 S1
Publication typeGrant
Application numberUS 29/268,190
Publication dateNov 18, 2008
Filing dateNov 1, 2006
Priority dateMay 1, 2006
Publication number268190, 29268190, US D580894 S1, US D580894S1, US-S1-D580894, USD580894 S1, USD580894S1
InventorsIzumi Sato
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Wafer boat
US D580894 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a wafer boat, as shown and described.
Description

FIG. 1 is a side sectional view of the wafer boat as viewed along line 11 in FIG. 6.

FIG. 2 is a cross sectional view of the wafer boat as viewed along line 22 in FIG. 9.

FIG. 3 is another side sectional view of the wafer boat.

FIG. 4 is another side sectional view of the wafer boat.

FIG. 5 is perspective view of the wafer boat.

FIG. 6 is a bottom view of the wafer boat.

FIG. 7 is an enlarged, side, isolated view of a portion of the wafer boat within the area 77 in FIG. 9.

FIG. 8 is a top view of the wafer boat; and,

FIG. 9 is another side view of the wafer boat with focus on the portion shown in FIG. 7.

The rear elevation appears symmetrical with an elevational view.

Broken lines are used throughout the drawings to disclose the environment related to the claimed design. Dash lines are used throughout the drawings to define the boundary of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US20110062053 *Jul 13, 2010Mar 17, 2011Greene Tweed Of Delaware, Inc.Chimerized Wafer Boat for Use in Semiconductor Chip Processing and Related Methods
USD734730 *Jun 26, 2013Jul 21, 2015Hitachi Kokusai Electric Inc.Boat of substrate processing apparatus
USD737785 *Jan 27, 2014Sep 1, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD738329 *Jan 27, 2014Sep 8, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD739831 *Sep 20, 2013Sep 29, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD740769 *Sep 20, 2013Oct 13, 2015Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD747279 *Jan 27, 2014Jan 12, 2016Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD748593 *Mar 5, 2014Feb 2, 2016Hzo, Inc.Boat for use in a material deposition apparatus
USD763807 *May 22, 2014Aug 16, 2016Hzo, Inc.Boat for a deposition apparatus
USD769201 *Apr 30, 2015Oct 18, 2016Tokyo Electron LimitedWafer boat
USD772183 *Apr 30, 2015Nov 22, 2016Tokyo Electron LimitedWafer boat
Classifications
U.S. ClassificationD13/182