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Publication numberUSD580895 S1
Publication typeGrant
Application numberUS 29/306,339
Publication dateNov 18, 2008
Filing dateApr 8, 2008
Priority dateMay 1, 2006
Also published asUSD568838
Publication number29306339, 306339, US D580895 S1, US D580895S1, US-S1-D580895, USD580895 S1, USD580895S1
InventorsNaohiro Terada, Kouji Kataoka, Tetsuya Ohsawa, Toshiki Naito
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grooves formed around a semiconductor device on a circuit board
US D580895 S1
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Claims(1)
  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
Description

FIG. 1 shows a plan view of the design according to a first embodiment of the invention.

FIG. 2 shows a bottom view of the design according to the invention. A claimed portion is not seen from the bottom.

FIG. 3 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 4 shows an enlarged sectional view along the line 44 in FIG. 3.

FIG. 5 shows an enlarged sectional view along the line 55 in FIG. 3.

FIG. 6 shows a perspective view of the design in FIG. 1, on which an semiconductor device (not claimed) is disposed.

FIG. 7 shows an enlarged sectional view along the line 55 in FIG. 3, on which a semiconductor device (not claimed) is disposed.

FIG. 8 shows a plan view of the design according to a second embodiment of the invention.

FIG. 9 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 8.

FIG. 10 shows an enlarged sectional view along the line 1010 in FIG. 9; and,

FIG. 11 shows an enlarged sectional view along the line 1111 in FIG. 9.

The elements shown in broken lines are for illustrative purpose only and form no part of the claimed invention.

Classifications
U.S. ClassificationD13/182