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Publication numberUSD581237 S1
Publication typeGrant
Application numberUS 29/296,712
Publication dateNov 25, 2008
Filing dateOct 26, 2007
Priority dateMar 17, 2004
Also published asUSD559063
Publication number29296712, 296712, US D581237 S1, US D581237S1, US-S1-D581237, USD581237 S1, USD581237S1
InventorsTakahiro Okamoto, Hiroshi Shiho
Original AssigneeJsr Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad
US D581237 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a polishing pad, as shown and described.
Description

FIG. 1 is a top plan view of a polishing pad, showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front elevational view thereof, the left side elevational view, the right side elevational view and the rear elevational view being a mirror image of the front view shown;

FIG. 4 is an enlarged, partial view thereof taken at coordinates 44 in FIG. 1;

FIG. 5 is a greatly enlarged, view thereof taken at coordinates 55 in FIG. 1;

FIG. 6 is a cross-sectional view thereof taken along line 66 in FIG. 5;

FIG. 7 is a greatly enlarged, partial cross-sectional view of part 7 shown in FIG. 6;

FIG. 8 is a greatly enlarged, partial view thereof taken at coordinates 8-5 in FIG. 1;

FIG. 9 is a cross-sectional view thereof taken along line 99 in FIG. 8;

FIG. 10 is a further enlargement of the cross-sectional view of part 10 in FIG. 9;

FIG. 11 is a further enlargement of the cross-sectional view of part 11 in FIG. 7; and,

FIG. 12 is a further enlargement of the cross-sectional view of part 12 of FIG. 10.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9017140Jan 13, 2010Apr 28, 2015Nexplanar CorporationCMP pad with local area transparency
US9156124Jul 8, 2010Oct 13, 2015Nexplanar CorporationSoft polishing pad for polishing a semiconductor substrate
US9180570Mar 16, 2009Nov 10, 2015Nexplanar CorporationGrooved CMP pad
Classifications
U.S. ClassificationD08/70