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Publication numberUSD582574 S1
Publication typeGrant
Application numberUS 29/279,405
Publication dateDec 9, 2008
Filing dateApr 30, 2007
Priority dateOct 31, 2006
Publication number279405, 29279405, US D582574 S1, US D582574S1, US-S1-D582574, USD582574 S1, USD582574S1
InventorsMichael James Mackenzie
Original AssigneeRoboloo, Cc
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Wall panel for a modular building structure
US D582574 S1
Images(6)
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Claims(1)
  1. The ornamental design for a wall panel for a modular building structure, as shown and described.
Description

FIG. 1 is a perspective view of a wall panel for a modular building structure;

FIG. 2 is a perspective view of FIG. 1, showing the opposite side thereof;

FIG. 3 is a front elevation view of FIG. 1;

FIG. 4 is a side elevation view of FIG. 1;

FIG. 5 is a top plan view of FIG. 1; and,

FIG. 6 is a bottom plan view of FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7691486Mar 16, 2009Apr 6, 20103Form, Inc.Translucent, post-formable, decorative architectural resin panels having a laminate layer such as thinly sliced natural wood or stone; the layer is not cracked, crushed, or damaged during the laminating or thermoforming process; layers are bendable after fusing
US8512505Feb 11, 2010Aug 20, 20133Form, Inc.Methods of forming architectural resin panels with translucent veneer layers
Classifications
U.S. ClassificationD25/138
Legal Events
DateCodeEventDescription
Oct 28, 2008ASAssignment
Owner name: NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY,
Owner name: TOKYO ELECTRON LIMITED, JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MOYAMA, KAZUKI;YAGI, YASUSHI;WATANABE, SHINGO;AND OTHERS;REEL/FRAME:021747/0886;SIGNING DATES FROM 20080723 TO 20080827