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Publication numberUSD584249 S1
Publication typeGrant
Application numberUS 29/303,706
Publication dateJan 6, 2009
Filing dateFeb 15, 2008
Priority dateMay 1, 2006
Also published asUSD567774, USD584250
Publication number29303706, 303706, US D584249 S1, US D584249S1, US-S1-D584249, USD584249 S1, USD584249S1
InventorsEmiko TANI, Tetsuya Ohsawa
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grooves formed around a semiconductor device on a circuit board
US D584249 S1
Images(3)
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Claims(1)
  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
Description

FIG. 1 shows a plan view of the grooves formed around a semiconductor device on a circuit board showing the design according to the invention.

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 3 shows an enlarged sectional view along the line 33 in FIG. 2; and,

FIG. 4 shows an enlarged sectional view along the line 44 in FIG. 2.

The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention.

Classifications
U.S. ClassificationD13/182