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Publication numberUSD584249 S1
Publication typeGrant
Application numberUS 29/303,706
Publication dateJan 6, 2009
Filing dateFeb 15, 2008
Priority dateMay 1, 2006
Also published asUSD567774, USD584250
Publication number29303706, 303706, US D584249 S1, US D584249S1, US-S1-D584249, USD584249 S1, USD584249S1
InventorsEmiko TANI, Tetsuya Ohsawa
Original AssigneeNitto Denko Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Grooves formed around a semiconductor device on a circuit board
US D584249 S1
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
Description

FIG. 1 shows a plan view of the grooves formed around a semiconductor device on a circuit board showing the design according to the invention.

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 3 shows an enlarged sectional view along the line 33 in FIG. 2; and,

FIG. 4 shows an enlarged sectional view along the line 44 in FIG. 2.

The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8950681Nov 15, 2011Feb 10, 2015Blackberry LimitedUniversal integrated circuit card apparatus and related methods
USD691610Nov 7, 2011Oct 15, 2013Blackberry LimitedDevice smart card
USD692005 *Sep 13, 2012Oct 22, 2013Blackberry LimitedDevice smart card
USD702694Sep 13, 2012Apr 15, 2014Blackberry LimitedDevice smart card
Classifications
U.S. ClassificationD13/182