|Publication number||USD584250 S1|
|Application number||US 29/303,707|
|Publication date||Jan 6, 2009|
|Filing date||Feb 15, 2008|
|Priority date||May 1, 2006|
|Also published as||USD567774, USD584249|
|Publication number||29303707, 303707, US D584250 S1, US D584250S1, US-S1-D584250, USD584250 S1, USD584250S1|
|Inventors||Emiko TANI, Tetsuya Ohsawa|
|Original Assignee||Nitto Denko Corporation|
|Export Citation||BiBTeX, EndNote, RefMan|
|Classifications (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Grooves formed around a semiconductor device on a circuit board
US D584250 S1
The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
FIG. 1 shows a plan view of the grooves formed around a semiconductor on a circuit board showing the design according to the invention.
FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.
FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2; and,
FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 2.
The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention.