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Publication numberUSD584591 S1
Publication typeGrant
Application numberUS 29/295,292
Publication dateJan 13, 2009
Filing dateSep 25, 2007
Priority dateOct 26, 2004
Also published asUSD559066, USD592029, USD592030, USD600989
Publication number29295292, 295292, US D584591 S1, US D584591S1, US-S1-D584591, USD584591 S1, USD584591S1
InventorsHiroyuki Tano, Hiroshi Shiho
Original AssigneeJsr Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Polishing pad
US D584591 S1
Abstract  available in
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  1. The ornamental design for a polishing pad, as shown and described.

FIG. 1 is a top plan view of a polishing pad showing our new design;

FIG. 2 is a front elevational view thereof, the rear elevation view, left and right side elevational views being a mirror image of the side shown;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a partial, enlarged view of portion 44 in FIG. 1;

FIG. 5 is a partial, enlarged sectional view taken along line 55 in FIG. 4

FIG. 6 is a partial, enlarged sectional view taken along line 66 in FIG. 4;

FIG. 7 is a partial, greatly enlarged sectional view of portion 7 in FIG. 5; and,

FIG. 8 is a partial, enlarged view of portion 88 in FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9180570Mar 16, 2009Nov 10, 2015Nexplanar CorporationGrooved CMP pad
U.S. ClassificationD08/70