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Publication numberUSD586768 S1
Publication typeGrant
Application numberUS 29/274,293
Publication dateFeb 17, 2009
Filing dateApr 11, 2007
Priority dateOct 12, 2006
Publication number274293, 29274293, US D586768 S1, US D586768S1, US-S1-D586768, USD586768 S1, USD586768S1
InventorsHisashi Inoue, Atsushi Endo
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Process tube for manufacturing semiconductor wafers
US D586768 S1
Abstract  available in
Images(6)
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Claims(1)
  1. The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described.
Description

FIG. 1 is a front view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a sectional view thereof along line 77 of FIG. 5;

FIG. 8 is a sectional view thereof along line 88 of FIG. 5;

FIG. 9 is a sectional view thereof along line 99 of FIG. 1; and,

FIG. 10 is a front, perspective view thereof.

In the preferred embodiment, the entire body of the process tube is transparent such that the inside of the tube can be seen. Dash lines show the boundary of the claimed design.

The broken lines define portions of the process tube that form no part of the claimed design.

Classifications
U.S. ClassificationD13/182