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Publication numberUSD587222 S1
Publication typeGrant
Application numberUS 29/276,663
Publication dateFeb 24, 2009
Filing dateFeb 1, 2007
Priority dateAug 1, 2006
Publication number276663, 29276663, US D587222 S1, US D587222S1, US-S1-D587222, USD587222 S1, USD587222S1
InventorsYasuharu Sasaki, Mamoru Kosakai
Original AssigneeTokyo Electron Limited, Sumitomo Osaka Cement Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Attracting plate of an electrostatic chuck for semiconductor manufacturing
US D587222 S1
Abstract  available in
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Claims(1)
  1. The ornamental design for an attracting plate of an electrostatic chuck for semiconductor manufacturing, as shown and described.
Description

FIG. 1 is a front elevational view of an attracting plate of an electrostatic chuck for semiconductor manufacturing, showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is an enlarged view thereof taken along sections A—A and B—B in FIG. 1;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a cross-sectional view taken along line 77 in FIG. 4 with portions of the internal mechanism omitted; and,

FIG. 8 is a front perspective view thereof.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

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US8475644Oct 26, 2009Jul 2, 2013Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9309604May 31, 2013Apr 12, 2016Novellus Systems, Inc.Method and apparatus for electroplating
US9394620Jun 18, 2014Jul 19, 2016Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9449808May 29, 2013Sep 20, 2016Novellus Systems, Inc.Apparatus for advanced packaging applications
US9464361Jun 19, 2014Oct 11, 2016Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9512538Sep 10, 2012Dec 6, 2016Novellus Systems, Inc.Plating cup with contoured cup bottom
US9523155Dec 11, 2013Dec 20, 2016Novellus Systems, Inc.Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US20100032310 *Nov 7, 2008Feb 11, 2010Novellus Systems, Inc.Method and apparatus for electroplating
US20100044236 *Oct 26, 2009Feb 25, 2010Novellus Systems, Inc.Method and apparatus for electroplating
US20100116672 *Jun 9, 2009May 13, 2010Novellus Systems, Inc.Method and apparatus for electroplating
US20120087774 *Jan 25, 2007Apr 12, 2012Camtek LtdDiced Wafer Adaptor and a Method for Transferring a Diced Wafer
Classifications
U.S. ClassificationD13/182