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Publication numberUSD587222 S1
Publication typeGrant
Application numberUS 29/276,663
Publication dateFeb 24, 2009
Filing dateFeb 1, 2007
Priority dateAug 1, 2006
Publication number276663, 29276663, US D587222 S1, US D587222S1, US-S1-D587222, USD587222 S1, USD587222S1
InventorsYasuharu Sasaki, Mamoru Kosakai
Original AssigneeTokyo Electron Limited, Sumitomo Osaka Cement Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Attracting plate of an electrostatic chuck for semiconductor manufacturing
US D587222 S1
Images(9)
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Claims(1)
  1. The ornamental design for an attracting plate of an electrostatic chuck for semiconductor manufacturing, as shown and described.
Description

FIG. 1 is a front elevational view of an attracting plate of an electrostatic chuck for semiconductor manufacturing, showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is an enlarged view thereof taken along sections AA and BB in FIG. 1;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a cross-sectional view taken along line 77 in FIG. 4 with portions of the internal mechanism omitted; and,

FIG. 8 is a front perspective view thereof.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8308931Nov 7, 2008Nov 13, 2012Novellus Systems, Inc.Method and apparatus for electroplating
US8540857Aug 9, 2012Sep 24, 2013Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193May 18, 2011Jan 7, 2014Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8795480Jun 29, 2011Aug 5, 2014Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US20120087774 *Jan 25, 2007Apr 12, 2012Camtek LtdDiced Wafer Adaptor and a Method for Transferring a Diced Wafer
Classifications
U.S. ClassificationD13/182