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Publication numberUSD588078 S1
Publication typeGrant
Application numberUS 29/270,120
Publication dateMar 10, 2009
Filing dateDec 15, 2006
Priority dateJun 16, 2006
Publication number270120, 29270120, US D588078 S1, US D588078S1, US-S1-D588078, USD588078 S1, USD588078S1
InventorsMitsuhiro Okada, Yoshikazu Furusawa, Daisuke Suzuki
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipation deterrence link for semiconductor manufacture
US D588078 S1
Images(8)
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Claims(1)
  1. The ornamental design for a heat dissipation deterrence link for semiconductor manufacture, as shown and described.
Description

FIG. 1 is a front view of the design for a heat dissipation deterrence link for semiconductor manufacture in accordance with the invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a plan view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a sectional view thereof along AA of FIG. 1;

FIG. 8 is a perspective view thereof; and,

FIG. 9 shows a heat dissipation deterrence link for semiconductor manufacture in accordance with the invention in use.

In practice, a heat dissipation deterrence link is placed on the bottom of a thermostat plug that is included in a process tube for semiconductor manufacture. Then, in use, the link suppresses heat from a bottom sub-heater. Preferably, the heat dissipation deterrence link for semiconductor manufacture in accordance with the present invention is fabricated from quartz.

The broken line showing the environment is for illustrative purposes only and forms no part of the claimed design.

Classifications
U.S. ClassificationD13/182