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Publication numberUSD588080 S1
Publication typeGrant
Application numberUS 29/292,066
Publication dateMar 10, 2009
Filing dateSep 26, 2007
Priority dateSep 26, 2007
Publication number292066, 29292066, US D588080 S1, US D588080S1, US-S1-D588080, USD588080 S1, USD588080S1
InventorsJames Harnden, Anthony Chia, Hongbo Yang, Teng Hui
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
2021-8J matrix leadframe
US D588080 S1
Abstract  available in
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  1. The ornamental design for 2021-8J matrix leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of 2021-8J matrix leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the 2021-8J matrix leadframe shown in FIG. 1 for ease of illustration; and,

FIG. 3 is a perspective view of FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8587099 *May 2, 2012Nov 19, 2013Texas Instruments IncorporatedLeadframe having selective planishing
US8649820Nov 7, 2011Feb 11, 2014Blackberry LimitedUniversal integrated circuit card apparatus and related methods
US8936199Apr 23, 2012Jan 20, 2015Blackberry LimitedUICC apparatus and related methods
US8963300Oct 30, 2013Feb 24, 2015Texas Instruments IncorporationSemiconductor device with selective planished leadframe
US9006038 *Jul 9, 2013Apr 14, 2015Texas Instruments IncorporatedSelective leadframe planishing
US20130292811 *May 2, 2012Nov 7, 2013Texas Instruments IncorporatedLeadframe having selective planishing
USD701864 *Apr 23, 2012Apr 1, 2014Blackberry LimitedUICC apparatus
USD702240 *Apr 18, 2012Apr 8, 2014Blackberry LimitedUICC apparatus
USD703208 *Apr 13, 2012Apr 22, 2014Blackberry LimitedUICC apparatus
U.S. ClassificationD13/182