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Publication numberUSD588557 S1
Publication typeGrant
Application numberUS 29/292,225
Publication dateMar 17, 2009
Filing dateOct 2, 2007
Priority dateOct 2, 2007
Publication number292225, 29292225, US D588557 S1, US D588557S1, US-S1-D588557, USD588557 S1, USD588557S1
InventorsJames Harnden, Anthony Chia, Hongbo Yang, Teng Hui
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
4040-28J matrix leadframe
US D588557 S1
Abstract  available in
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  1. The ornamental design for 4040-28J matrix leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of 4040-28J matrix leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the 4040-28J matrix leadframe shown in FIG. 1 for ease of illustration; and,

FIG. 3 is a perspective view of FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8587099 *May 2, 2012Nov 19, 2013Texas Instruments IncorporatedLeadframe having selective planishing
US8963300Oct 30, 2013Feb 24, 2015Texas Instruments IncorporationSemiconductor device with selective planished leadframe
US9006038 *Jul 9, 2013Apr 14, 2015Texas Instruments IncorporatedSelective leadframe planishing
US20130292811 *May 2, 2012Nov 7, 2013Texas Instruments IncorporatedLeadframe having selective planishing
US20150221526 *Apr 13, 2015Aug 6, 2015Texas Instruments IncorporatedSelective planishing method for making a semiconductor device
USD761216 *Mar 31, 2015Jul 12, 2016Jiaxing Super Lighting Electric Appliance Co., LtdLED leadframe
U.S. ClassificationD13/182