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Publication numberUSD589028 S1
Publication typeGrant
Application numberUS 29/299,751
Publication dateMar 24, 2009
Filing dateJan 3, 2008
Priority dateJan 3, 2008
Publication number29299751, 299751, US D589028 S1, US D589028S1, US-S1-D589028, USD589028 S1, USD589028S1
InventorsAndrew Haapapuro, Viorel Drambarean
Original AssigneeEtymotic Research, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Low profile microphone tip assembly
US D589028 S1
Abstract  available in
Images(3)
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Claims(1)
  1. The ornamental design for a low profile microphone tip assembly, as shown and described.
Description

FIG. 1 is a perspective view of a low profile microphone tip assembly showing my new design, the broken line showing of the human form is for illustrative purposes only and forms no part of the claimed design;

FIG. 2 is a perspective view of the microphone tip assembly thereof;

FIG. 3 is a perspective view of the microphone tip assembly thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a front elevation view thereof;

FIG. 7 is a left side elevation view thereof; and,

FIG. 8 is a right side elevation view thereof.

The even broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD731456 *Mar 3, 2014Jun 9, 2015Sony Mobile Communications AbControl unit for earpiece
USD748602 *Jul 15, 2014Feb 2, 2016Sony Mobile Communications AbHeadset
USD750042 *Jul 14, 2014Feb 23, 2016Skullcandy, Inc.Headphone microphone
USD758353Apr 28, 2015Jun 7, 2016Apple Inc.Input mechanism
USD763222 *Jan 18, 2015Aug 9, 2016Echobox Audio, LLCIn-ear headphone device having a headphone housing made of titanium alloy
USD780155 *Jul 6, 2015Feb 28, 2017New Audio LLCEarphone device
USD782997 *Dec 7, 2015Apr 4, 2017Lg Electronics Inc.Earphone
Classifications
U.S. ClassificationD14/206, D14/225