USD589473S1 - Adhesive film material for use in manufacturing semiconductors - Google Patents
Adhesive film material for use in manufacturing semiconductors Download PDFInfo
- Publication number
- USD589473S1 USD589473S1 US29/293,537 US29353707F USD589473S US D589473 S1 USD589473 S1 US D589473S1 US 29353707 F US29353707 F US 29353707F US D589473 S USD589473 S US D589473S
- Authority
- US
- United States
- Prior art keywords
- adhesive film
- film material
- manufacturing semiconductors
- view
- semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
Claims (1)
- The ornamental design for adhesive film material for use in manufacturing semiconductors, as shown and described.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007014407 | 2007-05-30 | ||
JP2007014404 | 2007-05-30 | ||
JP2007014405 | 2007-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD589473S1 true USD589473S1 (en) | 2009-03-31 |
Family
ID=40474449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/293,537 Expired - Lifetime USD589473S1 (en) | 2007-05-30 | 2007-11-30 | Adhesive film material for use in manufacturing semiconductors |
Country Status (1)
Country | Link |
---|---|
US (1) | USD589473S1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD868995S1 (en) * | 2017-11-06 | 2019-12-03 | Hitachi High-Technologies Corporation | Gas diffusion plate for a plasma processing apparatus |
-
2007
- 2007-11-30 US US29/293,537 patent/USD589473S1/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
USD868995S1 (en) * | 2017-11-06 | 2019-12-03 | Hitachi High-Technologies Corporation | Gas diffusion plate for a plasma processing apparatus |
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